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4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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    Buy cheap 4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer from wholesalers
     
    Buy cheap 4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer from wholesalers
    • Buy cheap 4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer from wholesalers

    4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer

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    Brand Name : PAM-XIAMEN
    Price : By Case
    Payment Terms : T/T
    Supply Ability : 10,000 wafers/month
    Delivery Time : 5-50 working days
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    4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer

    4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer


    PAM-XIAMEN provides high quality single crystal SiC (Silicon Carbide)waferfor electronic and optoelectronic industry. SiC wafer is a next generation semiconductor materialwith unique electrical properties and excellent thermal properties for high temperature and high power device application. SiC wafer can be supplied in diameter 2~6 inch, both 4H and 6H SiC , N-type , Nitrogen doped , and semi-insulating type available.


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    SILICON CARBIDE MATERIAL PROPERTIES


    PolytypeSingle Crystal 4HSingle Crystal 6H
    Lattice Parametersa=3.076 Åa=3.073 Å
    c=10.053 Åc=15.117 Å
    Stacking SequenceABCBABCACB
    Band-gap3.26 eV3.03 eV
    Density3.21 · 103 kg/m33.21 · 103 kg/m3
    Therm. Expansion Coefficient4-5×10-6/K4-5×10-6/K
    Refraction Indexno = 2.719no = 2.707
    ne = 2.777ne = 2.755
    Dielectric Constant9.69.66
    Thermal Conductivity490 W/mK490 W/mK
    Break-Down Electrical Field2-4 · 108 V/m2-4 · 108 V/m
    Saturation Drift Velocity2.0 · 105 m/s2.0 · 105 m/s
    Electron Mobility800 cm2/V·S400 cm2/V·S
    hole Mobility115 cm2/V·S90 cm2/V·S
    Mohs Hardness~9~9

    4H N Type SC As-Cut Wafer, 2”Size


    2" 4H Silicon Carbide
    Item No.TypeOrientationThicknessGradeMicropipe DensitySurfaceUsable area
     N-Type
    S4H-51-N-SIC-330-A2" 4H-N0°/4°±0.5°330±25umA<10/cm2C/P>90%
    S4H-51-N-SIC-330-B2" 4H-N0°/4°±0.5°330±25umB< 30/cm2C/P>85%
    S4H-51-N-SIC-330-D2" 4H-N0°/4°±0.5°330±25umD<100/cm2C/P>75%
    S4H-51-N-SIC-370-L2" 4H-N0°/4°±0.5°370±25umD*L/L>75%
    S4H-51-N-SIC-410-AC2" 4H-N0°/4°±0.5°410±25umD*As-cut>75%
    S4H-51-N-SIC-C0510-AC-D2" 4H-N0°/4°±0.5°5~10mmD<100/cm2As-cut*
    S4H-51-N-SIC-C1015-AC-D2" 4H-N0°/4°±0.5°10~15mmD<100/cm2As-cut*
    S4H-51-N-SIC-C0510-AC-C2" 4H-N0°/4°±0.5°5~10mmC<50/cm2As-cut*
    S4H-51-N-SIC-C1015-AC-C2" 4H-N0°/4°±0.5°10~15mmC<50/cm2As-cut*

    SiC crystal growth

    Bulk crystal growth is the technique for fabrication of single crystalline substrates , making the base for further device processing.To have a breakthrough in SiC technology obviously we need production of SiC substrate with a reproducible process.6H- and 4H- SiC crystals are grown in graphite crucibles at high temperatures up to 2100—2500°C. The operating temperature in the crucible is provided either by inductive (RF) or resistive heating. The growth occurs on thin SiC seeds. The source represents polycrystalline SiC powder charge. The SiC vapor in the growth chamber mainly consists of three species, namely, Si, Si2C, and SiC2, which are diluted by carrier gas, for example, Argon. The SiC source evolution includes both time variation of porosity and granule diameter and graphitization of the powder granules.

    Electrical Properties
    Owing to the differing arrangement of Si and C atoms within the SiC crystal lattice, each SiC polytype
    exhibits unique fundamental electrical and optical properties. Some of the more important semiconductor
    electrical properties of the 3C, 4H, and 6H SiC polytypes are given in Table 5.1. Much more
    detailed electrical properties can be found in References 11–13 and references therein. Even within a
    given polytype, some important electrical properties are nonisotropic, in that they are strong functions
    of crystallographic direction of current flow and applied electric field (for example, electron mobility
    for 6H-SiC). Dopant impurities in SiC can incorporate into energetically inequivalent sites. While all
    dopant ionization energies associated with various dopant incorporation sites should normally be
    considered for utmost accuracy, Table 5.1 lists only the shallowest reported ionization energies of each
    impurity

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    Quality 4H N Type SiC(Silicon Carbide) As-Cut Wafer, 2”Size - Powerway Wafer for sale
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