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Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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    Buy cheap Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices from wholesalers
     
    Buy cheap Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices from wholesalers
    • Buy cheap Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices from wholesalers

    Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices

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    Brand Name : PAM-XIAMEN
    Payment Terms : T/T
    Supply Ability : 10,000 wafers/month
    Delivery Time : 5-50 working days
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    Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices

    Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices


    PAM-XIAMEN manufactures high purity single crystal Indium Phosphide Wafers for optoelectronics applications. Our standard wafer diameters range from 25.4 mm (1 inch) to 200 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime grade, test grade, dummy grade, technical grade, and optical grade. PAM-XIAMEN also offer materials to customer specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies.


    Semi-Insulating, InP Wafer, 3”, Prime Grade

    3"InP Wafer Specification
    ItemSpecifications
    Conduction TypeSI-type
    DopantIron
    Wafer Diameter3"
    Wafer Orientation100±0.5°
    Wafer Thickness600±25um
    Primary Flat Length8±1mm
    Secondary Flat Length8±1mm
    Carrier Concentration≤3x1016cm-3(0.8-6)x1018cm-3(0.6-6)x1018cm-3N/A
    Mobility(3.5-4)x103cm2/V.s(1.5-3.5)x103cm2/V.s50-70cm2/V.s>1000cm2/V.s
    ResistivityN/AN/AN/A>0.5x107Ωcm
    EPD<1000cm-2<500cm-2<1x103cm-2<5x103cm-2
    TTV<12um
    BOW<12um
    WARP<12um
    Laser Markingupon request
    Suface FinishP/E, P/P
    Epi Readyyes
    PackageSingle wafer container or cassette

    Wafer Cleaning

    Wafer cleaning is an integral part of the wafer industry. The cleaning process involves the removal of particulate and chemical impurities from the semiconductor. It’s imperative during the cleaning process that the substrate is not damaged in any way. Wafer cleaning is ideal for silicon-based materials since it’s the most common element that is used. Some of the benefits of wafer cleaning include:

    • No damage to the silicon
    • Environmentally friendly
    • Safely and effectively removes any surface contaminants and imperfections
    • Enhances the performance of the wafer

    Impact Ionization

    The dependence of ionization rates for electrons αi and holes βi versus 1/F, 300 K.
    (Cook et al. [1982]).
    Breakdown voltage and breakdown field versus doping density for an abrupt p-n junction, 300 K
    (Kyuregyan and Yurkov [1989]).

    Applications

    The application fields of InP splits up into three main areas. It is used as the basis

    - for optoelectronic components

    - for high-speed electronics.

    - for photovoltaics

    There is still a vastly under-utilized, yet technically exciting zone in the electromagnetic spectrum between microwaves and infrared, often referred to as “Terahertz”. Electromagnetic waves in this range possess hybrid properties they show high-frequency- and optical characteristics simultaneously. InP based components unlock this spectral range for important new applications.


    Are You Looking for an InP substrate?

    PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for InP wafers, send us enquiry today to learn more about how we can work with you to get you the InP wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!


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