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Undoped Indium Arsenide Substrate , 4”, Test Grade

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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    Buy cheap Undoped Indium Arsenide Substrate , 4”, Test Grade from wholesalers
     
    Buy cheap Undoped Indium Arsenide Substrate , 4”, Test Grade from wholesalers
    • Buy cheap Undoped Indium Arsenide Substrate , 4”, Test Grade from wholesalers

    Undoped Indium Arsenide Substrate , 4”, Test Grade

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    Brand Name : PAM-XIAMEN
    Payment Terms : T/T
    Supply Ability : 10,000 wafers/month
    Delivery Time : 5-50 working days
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    Undoped Indium Arsenide Substrate , 4”, Test Grade

    Undoped Indium Arsenide Substrate, 4”, Test Grade

    PAM-XIAMEN offers InAs wafer – Indium Arsenide which are grown by LEC(Liquid Encapsulated Czochralski) or VGF(Vertical Gradient Freeze) as epi-ready or mechanical grade with n type, p type or undoped in different orientation(111),(100) or (110). PAM-XIAMEN can provide epi ready grade InAs wafer for your MOCVD & MBE epitaxial application .Please contact our engineer team for more wafer information.


    4" InAs Wafer Specification

    ItemSpecifications
    DopantUndoped
    Conduction TypeN-type
    Wafer Diameter4"
    Wafer Orientation(100)±0.5°
    Wafer Thickness900±25um
    Primary Flat Length16±2mm
    Secondary Flat Length8±1mm
    Carrier Concentration5x1016cm-3
    Mobility≥2x104cm2/V.s
    EPD<5x104cm-2
    TTV<15um
    BOW<15um
    WARP<20um
    Laser markingupon request
    Suface finishP/E, P/P
    Epi readyyes
    PackageSingle wafer container or cassette

    What is the InAs Process?

    InAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

    Thermal properties of InAs Wafer

    Bulk modulus5.8·1011 dyn cm-2
    Melting point942 °C
    Specific heat0.25 J g-1 °C-1
    Thermal conductivity0.27 W cm-1 °C-1
    Thermal diffusivity0.19 cm2s-1
    Thermal expansion, linear4.52·10-6 °C-1

    Temperature dependence of thermal conductivity.
    n-type sample, no (cm-3): 1. 1.6·1016; 2. 2.0·1017;
    p-type sample, po (cm-3): 3. 2.0·1017.

    Temperature dependences of thermal conductivity for high temperatures
    Electron concentration
    no (cm-3): 1. 5·1016; 2. 2·1016; 3. 3·1016.
    Temperature dependence of specific heat at constant pressure

    For 298K < T < 1215K

    Cp= 0.240 + 3.97·10-5·T (J g-1°C -1).


    Temperature dependence of linear expansion coefficient
    (low temperature)
    Temperature dependence of linear expansion coefficient
    (high temperature)
    Temperature dependences of Nernst coefficient (transverse Nernst-Ettinghausen effect)
    Electron concentration at 77K
    no (cm-3): 1. 2.96·1016; 2. 4.46·1016; 3. 8.43·1016; 4. 4.53·1017; 5. 1.56·1018; 6. 2.28·1018; 7. 5·1018; 8. 1.68·1019.

    Melting point Tm = 1215 K.
    Saturated vapor pressure (in Pascals):

    for 950 K - 2·10-3,
    for 1000 K - 10-2,
    for 1050 K - 10-1.


    Are You Looking for an InAs substrate?

    PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for InAs wafers, send us enquiry today to learn more about how we can work with you to get you the InAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

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